solder

英 [ˈsəʊldə(r)]

美 [ˈsɑːdər]

n.  焊料; 焊锡
v.  焊接; 焊合

过去分词：soldered　现在分词：soldering　复数：solders　第三人称单数：solders　过去式：soldered　

TOEFLGRE

BNC.24210 / COCA.24452

牛津词典

noun

• 焊料；焊锡
  a mixture of metals that is heated and melted and then used to join metals, wires, etc. together

verb

• 焊接；焊合
  to join pieces of metal or wire with solder

柯林斯词典

• VERB 焊;焊接;焊合
  If yousoldertwo pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
  1. Fewer workers are needed to solder circuit boards...
     焊接电路板需要的工人更少了。
  2. He then soldered the wire to the telephone terminal...
     接着他把电话线焊接到电话机上。
  3. He cuts the pieces and solders them together.
     他把那些断片切碎，然后把它们焊在一起。
• 焊料;焊锡
  Solderis the soft metal used for soldering.

英英释义

noun

• an alloy (usually of lead and tin) used when melted to join two metal surfaces

verb

• join or fuse with solder
  1. solder these two pipes together

双语例句

• They forget to solder the contacts.
  他们忘记了焊接切点。
• Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
  Sn-Zn，Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
• Other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.
  其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。
• This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints.
  此课程涵盖了高可靠无铅焊点、材料选择的详细要求。
• He cuts the pieces and solders them together.
  他把那些断片切碎，然后把它们焊在一起。
• The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
  导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
• The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
  本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
• The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.
  不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。
• Therefore, to improve the reliability of solder joints is one of the most important tasks for electronic industry.
  因此提高焊点的可靠性及寿命是电子业界相当重要的一个课题，故本研究也将朝这方面去执行。
• Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
  对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限？